Laser-assisted OSP micro-etching method
The invention relates to a laser-assisted OSP micro-etching method, which comprises the following steps: S1, cleaning treatment: firstly carrying out acidic oil removal treatment on a circuit board, carrying out water washing treatment on the oil-removed circuit board in a water washing process, and...
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| creator | LIU HENGFA YAN QINGXIA ZOU JIAQI LIAO RUNQIU JIAN TING |
| description | The invention relates to a laser-assisted OSP micro-etching method, which comprises the following steps: S1, cleaning treatment: firstly carrying out acidic oil removal treatment on a circuit board, carrying out water washing treatment on the oil-removed circuit board in a water washing process, and finally carrying out ultrasonic oscillation cleaning on the circuit board through an ultrasonic process to obtain a clean circuit board; s2, micro-etching treatment is conducted, specifically, the circuit board treated in the step S1 enters a spraying device, a laser transmitter is arranged in etching bath liquid of the spraying device, and the laser transmitter generates laser to conduct laser-assisted micro-etching on the circuit board while spraying is conducted on the circuit board through the spraying device; and S3, OSP film coating: after the circuit board is subjected to micro-etching treatment in the step S2, the circuit board enters an OSP film process, and OSP film coating treatment is carried out on th |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115361789A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115361789A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115361789A3</originalsourceid><addsrcrecordid>eNrjZFD3SSxOLdJNLC7OLC5JTVHwDw5QyM1MLsrXTS1JzsjMS1fITS3JyE_hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhqbGZobmFpaOxsSoAQB4wSeg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Laser-assisted OSP micro-etching method</title><source>esp@cenet</source><creator>LIU HENGFA ; YAN QINGXIA ; ZOU JIAQI ; LIAO RUNQIU ; JIAN TING</creator><creatorcontrib>LIU HENGFA ; YAN QINGXIA ; ZOU JIAQI ; LIAO RUNQIU ; JIAN TING</creatorcontrib><description>The invention relates to a laser-assisted OSP micro-etching method, which comprises the following steps: S1, cleaning treatment: firstly carrying out acidic oil removal treatment on a circuit board, carrying out water washing treatment on the oil-removed circuit board in a water washing process, and finally carrying out ultrasonic oscillation cleaning on the circuit board through an ultrasonic process to obtain a clean circuit board; s2, micro-etching treatment is conducted, specifically, the circuit board treated in the step S1 enters a spraying device, a laser transmitter is arranged in etching bath liquid of the spraying device, and the laser transmitter generates laser to conduct laser-assisted micro-etching on the circuit board while spraying is conducted on the circuit board through the spraying device; and S3, OSP film coating: after the circuit board is subjected to micro-etching treatment in the step S2, the circuit board enters an OSP film process, and OSP film coating treatment is carried out on th</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221118&DB=EPODOC&CC=CN&NR=115361789A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221118&DB=EPODOC&CC=CN&NR=115361789A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU HENGFA</creatorcontrib><creatorcontrib>YAN QINGXIA</creatorcontrib><creatorcontrib>ZOU JIAQI</creatorcontrib><creatorcontrib>LIAO RUNQIU</creatorcontrib><creatorcontrib>JIAN TING</creatorcontrib><title>Laser-assisted OSP micro-etching method</title><description>The invention relates to a laser-assisted OSP micro-etching method, which comprises the following steps: S1, cleaning treatment: firstly carrying out acidic oil removal treatment on a circuit board, carrying out water washing treatment on the oil-removed circuit board in a water washing process, and finally carrying out ultrasonic oscillation cleaning on the circuit board through an ultrasonic process to obtain a clean circuit board; s2, micro-etching treatment is conducted, specifically, the circuit board treated in the step S1 enters a spraying device, a laser transmitter is arranged in etching bath liquid of the spraying device, and the laser transmitter generates laser to conduct laser-assisted micro-etching on the circuit board while spraying is conducted on the circuit board through the spraying device; and S3, OSP film coating: after the circuit board is subjected to micro-etching treatment in the step S2, the circuit board enters an OSP film process, and OSP film coating treatment is carried out on th</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD3SSxOLdJNLC7OLC5JTVHwDw5QyM1MLsrXTS1JzsjMS1fITS3JyE_hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhqbGZobmFpaOxsSoAQB4wSeg</recordid><startdate>20221118</startdate><enddate>20221118</enddate><creator>LIU HENGFA</creator><creator>YAN QINGXIA</creator><creator>ZOU JIAQI</creator><creator>LIAO RUNQIU</creator><creator>JIAN TING</creator><scope>EVB</scope></search><sort><creationdate>20221118</creationdate><title>Laser-assisted OSP micro-etching method</title><author>LIU HENGFA ; YAN QINGXIA ; ZOU JIAQI ; LIAO RUNQIU ; JIAN TING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115361789A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU HENGFA</creatorcontrib><creatorcontrib>YAN QINGXIA</creatorcontrib><creatorcontrib>ZOU JIAQI</creatorcontrib><creatorcontrib>LIAO RUNQIU</creatorcontrib><creatorcontrib>JIAN TING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU HENGFA</au><au>YAN QINGXIA</au><au>ZOU JIAQI</au><au>LIAO RUNQIU</au><au>JIAN TING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Laser-assisted OSP micro-etching method</title><date>2022-11-18</date><risdate>2022</risdate><abstract>The invention relates to a laser-assisted OSP micro-etching method, which comprises the following steps: S1, cleaning treatment: firstly carrying out acidic oil removal treatment on a circuit board, carrying out water washing treatment on the oil-removed circuit board in a water washing process, and finally carrying out ultrasonic oscillation cleaning on the circuit board through an ultrasonic process to obtain a clean circuit board; s2, micro-etching treatment is conducted, specifically, the circuit board treated in the step S1 enters a spraying device, a laser transmitter is arranged in etching bath liquid of the spraying device, and the laser transmitter generates laser to conduct laser-assisted micro-etching on the circuit board while spraying is conducted on the circuit board through the spraying device; and S3, OSP film coating: after the circuit board is subjected to micro-etching treatment in the step S2, the circuit board enters an OSP film process, and OSP film coating treatment is carried out on th</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS |
| title | Laser-assisted OSP micro-etching method |
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