Laser-assisted OSP micro-etching method

The invention relates to a laser-assisted OSP micro-etching method, which comprises the following steps: S1, cleaning treatment: firstly carrying out acidic oil removal treatment on a circuit board, carrying out water washing treatment on the oil-removed circuit board in a water washing process, and...

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Bibliographische Detailangaben
Hauptverfasser: LIU HENGFA, YAN QINGXIA, ZOU JIAQI, LIAO RUNQIU, JIAN TING
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention relates to a laser-assisted OSP micro-etching method, which comprises the following steps: S1, cleaning treatment: firstly carrying out acidic oil removal treatment on a circuit board, carrying out water washing treatment on the oil-removed circuit board in a water washing process, and finally carrying out ultrasonic oscillation cleaning on the circuit board through an ultrasonic process to obtain a clean circuit board; s2, micro-etching treatment is conducted, specifically, the circuit board treated in the step S1 enters a spraying device, a laser transmitter is arranged in etching bath liquid of the spraying device, and the laser transmitter generates laser to conduct laser-assisted micro-etching on the circuit board while spraying is conducted on the circuit board through the spraying device; and S3, OSP film coating: after the circuit board is subjected to micro-etching treatment in the step S2, the circuit board enters an OSP film process, and OSP film coating treatment is carried out on th