Method and device for improving photoetching precision
The invention provides a method and a device for improving photoetching precision, and relates to the technical field of photoetching, a laser cutting process is introduced, the high precision characteristic of the laser cutting process is utilized to realize manufacturing of a standard pattern on a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a method and a device for improving photoetching precision, and relates to the technical field of photoetching, a laser cutting process is introduced, the high precision characteristic of the laser cutting process is utilized to realize manufacturing of a standard pattern on a standard sheet, and then the standard pattern on the standard sheet and a photoetching pattern on a photoetching mask are aligned in an overlay manner, so that the photoetching precision is improved. The calibration of the correct placement position (production position) of the product substrate can be quickly completed, so that the calibration frequency and the calibration time in the calibration process can be effectively reduced, the product substrate can be conveniently placed at the calibrated production position in actual production, the product substrate and the photoetching mask can be aligned with each other with high precision, and the photoetching precision is further improved.
本申请提供一种提高光刻精度的方法及装置,涉及光刻技 |
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