Protection method for welding area of electronic packaging shell

The invention discloses a protection method for a welding area of an electronic packaging shell. The protection method comprises the following steps of shell assembly welding, alkaline oil removal, acid pickling, activation, nickel pre-plating, nickel plating and drying. According to the method, the original welding area is wrapped and protected in the mode that the plating layer is additionally arranged in the welding area, the tolerable highest temperature of the welding area can be improved through introduction of the plating layer, the welding area cannot be molten again in the welding process in the multiple welding processes, and therefore protection of the welding area is achieved. Remelting of the welding area of the ceramic shell can be avoided, and the welding area is more compact. 本发明公开了一种电子封装外壳焊接区域的保护方法，包括以下步骤：外壳组件焊接，碱性除油，酸洗，活化，预镀镍，镀镍和烘干。本发明利用在焊接区域增加镀覆层的方式，对原有的焊接区域进行包裹保护，镀覆层的引入可以提升焊接区域的可耐受最高温度，使多次焊接过程中，焊接区域不会由于焊接过程而出现重新熔化，从而实现焊接区域的保护，通过该种方法，可以避免陶瓷外壳的焊接区域的重熔，使焊接区域更为致密。