Pore-filling leveling agent and acidic copper electroplating bath containing same

The invention provides a hole-filling leveling agent and an acidic copper electroplating bath containing the same. The leveling agent is formed by reacting an amino glycidyl compound, a secondary amine compound and an alkylating reagent, the acid copper electroplating bath comprises the hole-filling...

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Bibliographische Detailangaben

Hauptverfasser:	LEI HUASHAN, DUAN XIAOLONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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