Pore-filling leveling agent and acidic copper electroplating bath containing same

The invention provides a hole-filling leveling agent and an acidic copper electroplating bath containing the same. The leveling agent is formed by reacting an amino glycidyl compound, a secondary amine compound and an alkylating reagent, the acid copper electroplating bath comprises the hole-filling leveling agent, copper sulfate pentahydrate, sulfuric acid, chloride ions, an electroplating accelerator and an inhibitor, the leveling agent is used in the hole-filling acid copper electroplating bath, the blind hole can be rapidly and perfectly filled and leveled up by using small current density and short hole filling time, the plating thickness of the filled and leveled-up surface of the blind hole can be greatly reduced, and the hole filling quality is improved. And the hole-filling plating layer is high in quality reliability, and the surface copper of the board surface does not need to be further thinned before circuit etching, so that the circuit etching difficulty and the process production cost can be ef