RESIN COMPOSITION, PACKAGING STRUCTURE AND METHOD FOR FORMING RESIN COMPOSITION

The invention relates to a resin composition, a packaging structure and a method for forming the resin composition. Specifically, the invention provides a resin composition, which comprises: a first polymer formed by reacting a first elastic molecular chain segment modified epoxy resin with an epoxy...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LIN CHENGYI, CHEN SHIMING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a resin composition, a packaging structure and a method for forming the resin composition. Specifically, the invention provides a resin composition, which comprises: a first polymer formed by reacting a first elastic molecular chain segment modified epoxy resin with an epoxy resin curing agent; and the second polymer is formed by polymerizing acrylic ester modified by a second elastic molecular chain segment. 本发明涉及树脂组合物、封装结构与树脂组合物形成的方法。具体地说，本发明提供一种树脂组合物，包括：第一弹性分子链段改性的环氧树脂与环氧树脂固化剂反应形成的第一聚合物；以及第二弹性分子链段改性的丙烯酸酯聚合而成的第二聚合物。