Terminal and method for preparing terminal surface cover plate

The invention provides a terminal and a method for preparing a terminal surface cover plate. The terminal comprises a cover plate and a back plate, wherein the cover plate and the back plate are oppositely arranged to form an accommodating space; the circuit board is arranged in the accommodating sp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ZHANG ANGRAN, MEI SIYANG, XIE PENGFEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES TELEPHONIC COMMUNICATION USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The invention provides a terminal and a method for preparing a terminal surface cover plate. The terminal comprises a cover plate and a back plate, wherein the cover plate and the back plate are oppositely arranged to form an accommodating space; the circuit board is arranged in the accommodating space; wherein the cover plate comprises an ink area, and the ink area comprises a plurality of ink layers; and the total thickness of the plurality of ink layers is 19-22 microns. The stability of the cover plate can be guaranteed through the arrangement of the multiple ink layers. 本公开提供了终端和终端表面盖板制备的方法。其中，终端包括：盖板和背板；其中，所述盖板和所述背板相对设置形成容置空间；及电路板，设置于所述容置空间内；其中，所述盖板包括油墨区，所述油墨区包括多个油墨层；所述多个油墨层的总厚度为19-22微米。本公开能够通过多个油墨层的设置保证盖板的稳固性。