METHOD OF TRANSFERRING ELECTRONIC COMPONENTS

The invention provides a method for transferring electronic components, which comprises the following steps of: providing a flexible carrier with a plurality of electronic components on one side; providing a target substrate, and enabling the target substrate to be correspondingly configured with the surface of the flexible carrier; an ejector pin is provided, the abutting end of the ejector pin abuts against the other face of the face, not carrying the electronic assembly, of the flexible carrier, the flexible carrier is made to deform, and the at least one electronic assembly moves towards the target substrate and makes contact with the target substrate; providing a light beam, enabling the light beam to pass through at least one part of the ejector pin and to be emitted from the abutting end part so as to melt the welding flux, and welding and fixing the electronic component on the target substrate through the welding flux; and the ejector pin is moved to enable the flexible carrier to return to the origin