Wafer cleaning device with automatic feeding function

The invention discloses an automatic feeding wafer cleaning device, and relates to the technical field of semiconductor material manufacturing. An outer cylinder is fixedly installed on the upper side of the fixing disc, a connecting cylinder is arranged on the outer circumference of the rotating sh...

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Hauptverfasser: CAI CHAO, PAN YULU
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creator CAI CHAO
PAN YULU
description The invention discloses an automatic feeding wafer cleaning device, and relates to the technical field of semiconductor material manufacturing. An outer cylinder is fixedly installed on the upper side of the fixing disc, a connecting cylinder is arranged on the outer circumference of the rotating shaft, a protruding block on a connecting body vertically moves in a first sliding groove of the rotating shaft, and cleaning mechanisms are evenly arranged on the top of the connecting cylinder in the circumferential direction. The cleaning mechanism sequentially passes through the uncleaned wafer placing box, the second fixing plate, the first fixing plate, the two symmetrical air injection plates and the cleaned wafer placing box. The rotating shaft drives the connecting cylinder to slide in the second sliding groove of the outer cylinder, the protruding block of the connecting body moves in the first sliding groove in the inner circumferential side wall of the rotating shaft in the vertical direction, and the con
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115312436A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115312436A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115312436A3</originalsourceid><addsrcrecordid>eNrjZDANT0xLLVJIzklNzMvMS1dISS3LTE5VKM8syVBILC3Jz00syUxWSEtNTQHJppXmJZdk5ufxMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQ1NjQyMTYzNHY2LUAABoGi0x</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer cleaning device with automatic feeding function</title><source>esp@cenet</source><creator>CAI CHAO ; PAN YULU</creator><creatorcontrib>CAI CHAO ; PAN YULU</creatorcontrib><description>The invention discloses an automatic feeding wafer cleaning device, and relates to the technical field of semiconductor material manufacturing. An outer cylinder is fixedly installed on the upper side of the fixing disc, a connecting cylinder is arranged on the outer circumference of the rotating shaft, a protruding block on a connecting body vertically moves in a first sliding groove of the rotating shaft, and cleaning mechanisms are evenly arranged on the top of the connecting cylinder in the circumferential direction. The cleaning mechanism sequentially passes through the uncleaned wafer placing box, the second fixing plate, the first fixing plate, the two symmetrical air injection plates and the cleaned wafer placing box. The rotating shaft drives the connecting cylinder to slide in the second sliding groove of the outer cylinder, the protruding block of the connecting body moves in the first sliding groove in the inner circumferential side wall of the rotating shaft in the vertical direction, and the con</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221108&amp;DB=EPODOC&amp;CC=CN&amp;NR=115312436A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,782,887,25573,76557</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221108&amp;DB=EPODOC&amp;CC=CN&amp;NR=115312436A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CAI CHAO</creatorcontrib><creatorcontrib>PAN YULU</creatorcontrib><title>Wafer cleaning device with automatic feeding function</title><description>The invention discloses an automatic feeding wafer cleaning device, and relates to the technical field of semiconductor material manufacturing. An outer cylinder is fixedly installed on the upper side of the fixing disc, a connecting cylinder is arranged on the outer circumference of the rotating shaft, a protruding block on a connecting body vertically moves in a first sliding groove of the rotating shaft, and cleaning mechanisms are evenly arranged on the top of the connecting cylinder in the circumferential direction. The cleaning mechanism sequentially passes through the uncleaned wafer placing box, the second fixing plate, the first fixing plate, the two symmetrical air injection plates and the cleaned wafer placing box. The rotating shaft drives the connecting cylinder to slide in the second sliding groove of the outer cylinder, the protruding block of the connecting body moves in the first sliding groove in the inner circumferential side wall of the rotating shaft in the vertical direction, and the con</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDANT0xLLVJIzklNzMvMS1dISS3LTE5VKM8syVBILC3Jz00syUxWSEtNTQHJppXmJZdk5ufxMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQ1NjQyMTYzNHY2LUAABoGi0x</recordid><startdate>20221108</startdate><enddate>20221108</enddate><creator>CAI CHAO</creator><creator>PAN YULU</creator><scope>EVB</scope></search><sort><creationdate>20221108</creationdate><title>Wafer cleaning device with automatic feeding function</title><author>CAI CHAO ; PAN YULU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115312436A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CAI CHAO</creatorcontrib><creatorcontrib>PAN YULU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CAI CHAO</au><au>PAN YULU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer cleaning device with automatic feeding function</title><date>2022-11-08</date><risdate>2022</risdate><abstract>The invention discloses an automatic feeding wafer cleaning device, and relates to the technical field of semiconductor material manufacturing. An outer cylinder is fixedly installed on the upper side of the fixing disc, a connecting cylinder is arranged on the outer circumference of the rotating shaft, a protruding block on a connecting body vertically moves in a first sliding groove of the rotating shaft, and cleaning mechanisms are evenly arranged on the top of the connecting cylinder in the circumferential direction. The cleaning mechanism sequentially passes through the uncleaned wafer placing box, the second fixing plate, the first fixing plate, the two symmetrical air injection plates and the cleaned wafer placing box. The rotating shaft drives the connecting cylinder to slide in the second sliding groove of the outer cylinder, the protruding block of the connecting body moves in the first sliding groove in the inner circumferential side wall of the rotating shaft in the vertical direction, and the con</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
title Wafer cleaning device with automatic feeding function
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-02T16%3A03%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CAI%20CHAO&rft.date=2022-11-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN115312436A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true