Wafer cleaning device with automatic feeding function

The invention discloses an automatic feeding wafer cleaning device, and relates to the technical field of semiconductor material manufacturing. An outer cylinder is fixedly installed on the upper side of the fixing disc, a connecting cylinder is arranged on the outer circumference of the rotating shaft, a protruding block on a connecting body vertically moves in a first sliding groove of the rotating shaft, and cleaning mechanisms are evenly arranged on the top of the connecting cylinder in the circumferential direction. The cleaning mechanism sequentially passes through the uncleaned wafer placing box, the second fixing plate, the first fixing plate, the two symmetrical air injection plates and the cleaned wafer placing box. The rotating shaft drives the connecting cylinder to slide in the second sliding groove of the outer cylinder, the protruding block of the connecting body moves in the first sliding groove in the inner circumferential side wall of the rotating shaft in the vertical direction, and the con