Thermoelectric semiconductor device and manufacturing method thereof

A thermoelectric semiconductor device includes a heat dissipating semiconductor module and a flash memory die stack mounted on a substrate. The heat dissipation module includes a first semiconductor die, such as a controller, and a second semiconductor die, such as a thermoelectric semiconductor die, to cool the first semiconductor die during operation. The thermoelectric semiconductor die may be mounted to the controller die at a wafer level. 一种热电半导体装置包含安装在衬底上的散热半导体模块和快闪存储器裸片堆叠。所述散热模块包括例如控制器的第一半导体裸片和例如热电半导体裸片的第二半导体裸片以在操作期间冷却所述第一半导体裸片。所述热电半导体裸片可在晶片级安装到所述控制器裸片。