Wafer defect detection method based on image enhancement

The invention relates to the technical field of data processing, in particular to a wafer defect detection method based on image enhancement, which comprises the following steps: acquiring a wafer image, partitioning the wafer image, and obtaining a gradient magnitude histogram of each partitioned i...

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1. Verfasser: ZHENG JUNZE
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of data processing, in particular to a wafer defect detection method based on image enhancement, which comprises the following steps: acquiring a wafer image, partitioning the wafer image, and obtaining a gradient magnitude histogram of each partitioned image; acquiring a compression upper limit value according to the maximum gradient magnitude in the gradient magnitude histograms of the block images, and performing equal-ratio compression on the gradient magnitudes to obtain a compression gradient magnitude histogram; segmenting the compression gradient magnitude histogram, obtaining the probability density and the average gradient of each segment, and further obtaining the enhancement weight of each segment; and obtaining expectation and standard deviation according to the compression gradient magnitude histogram, further obtaining an enhancement function of the block image by combining the enhancement weight of each fragment, and enhancing the block image by usi