Power supply structure and electroplating device

The invention provides a power supply structure and an electroplating device. The electroplating device comprises a conveying mechanism, a plurality of processing units and the power supply structure. The power supply structure comprises a power supply part, a main conductive part, a plurality of branch conductive parts and a plurality of wires. The power supply part is connected with the main conductive part and supplies power to the main conductive part; the branch conductive parts are arranged in the processing units respectively, the conveying mechanism is used for driving the processing units to move around the main conductive part, and the multiple branch conductive parts are arranged on the periphery of the main conductive part in a surrounding mode and move around the main conductive part in sequence. Each branch conductive piece is electrically connected with the main conductive piece through a wire. The wire has elasticity, and the length of the wire can change along with the change of the distance