Surface treatment method of copper foil

The invention discloses a copper foil surface treatment method, and belongs to the technical field of copper foil surface treatment. Electrolyte used in the roughening treatment process is formed by mixing stearic acid, copper chloride, aluminum oxide, a dispersing agent, hydrochloric acid and water, electrochemical deposition is carried out with a copper foil as a cathode and a titanium plate as an anode, then the cathode copper foil is taken out and placed in water to be heated and dried, the copper foil with the roughened surface is obtained, then electroplating treatment is carried out in a copper chloride solution, and the copper foil with the roughened surface is obtained. And taking out the copper foil, coating the copper foil with a surface treatment agent consisting of potassium hypochlorite, potassium sulfate, sodium hexametaphosphate, ammonium persulfate and water, and then drying the copper foil to finish surface treatment of the copper foil. According to the copper foil surface treatment method,