Circuit board processing device capable of rapidly and chemically depositing nickel, palladium and gold
The invention discloses a rapid chemical nickel-palladium-gold immersion processing circuit board processing device which comprises a shell and a base, supporting plates are fixedly connected to the tops of the left side and the right side of the inner wall of the shell respectively, a control struc...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a rapid chemical nickel-palladium-gold immersion processing circuit board processing device which comprises a shell and a base, supporting plates are fixedly connected to the tops of the left side and the right side of the inner wall of the shell respectively, a control structure is connected to the inner walls of the supporting plates, a vertical plate is connected to the outer side of the bottom of the control structure, and a clamping structure is connected to the bottom of the vertical plate. According to the rapid chemical nickel-palladium gold immersion processing circuit board processing device, the circuit board is replaced while processing is conducted, the processing speed is increased, a ball is loosened, a spring provides elastic force to enable a protruding rod to drive a clamping plate to move upwards to clamp the circuit board, dismounting and mounting are convenient, time is saved, the inner wall of the shell is scraped and cleaned, and the processing efficiency is impr |
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