RESIN COMPOSITION, MOLDED ARTICLE, AND FLOW IMPROVING AGENT FOR LOW DIELECTRIC

The invention relates to a resin composition, a molded body, and a fluidity improving agent for low dielectric resin. The present invention addresses the problem of providing a resin composition which maintains the low dielectric properties of low dielectric resins such as liquid crystal polymers, p...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ITO TSUBASA, NAKATANI TAKASHI, SHIBACHI KOKI, SHIBAHARA RYO, KAWABATA AKIHIRO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!