RESIN COMPOSITION, MOLDED ARTICLE, AND FLOW IMPROVING AGENT FOR LOW DIELECTRIC

The invention relates to a resin composition, a molded body, and a fluidity improving agent for low dielectric resin. The present invention addresses the problem of providing a resin composition which maintains the low dielectric properties of low dielectric resins such as liquid crystal polymers, polyphenylene ether resins, polyphenylene sulfide resins, and polybutylene terephthalate resins, in which smoke formation during molding is suppressed, and which has excellent moldability and low dielectric properties. A resin composition includes: a resin (A) selected from at least one of a group consisting of a liquid crystal polymer, a polyphenylene ether resin, a polyphenylene sulfide resin, and a polybutylene terephthalate resin; and a petroleum resin (B), the 5% weight loss temperature of the petroleum resin (B) being 270 DEG C or higher, and the mixed methyl cyclohexane aniline cloud point (MMAP) of the petroleum resin (B) being 10-95 DEG C. 本发明涉及一种树脂组合物、成形体及低介电性树脂用的流动性提高剂。本发明的课题在于提供一种树脂组合物，其维持液晶聚合物、聚苯醚树脂、聚苯硫