Photosensitive resin composition, photosensitive element, and method for producing wiring substrate

The present invention provides a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene-based sensitizer, the binder polymer contains a polymer (a) having a hydroxyalkyl (meth) acrylate unit and a styrene or styrene derivative unit, wherein the content of the styrene or styrene derivative unit is 40 mass% or more. 本发明提供一种感光性树脂组合物，其含有粘合剂聚合物、光聚合性化合物、光聚合引发剂及蒽类增感剂，粘合剂聚合物包含具有(甲基)丙烯酸羟烷基酯单元及苯乙烯或苯乙烯衍生物单元且苯乙烯或苯乙烯衍生物单元的含量为40质量％以上的聚合物(a)。