Fan-out packaging method and packaging structure

The invention provides a fan-out packaging method and a packaging structure, and belongs to the technical field of semiconductor packaging, and the method comprises the steps: respectively providing a chip, a temporary carrying disc and a magnetic carrying disc; forming a conductive connecting piece on the first surface of the chip, and fixing the first surface of the chip on the temporary carrier plate; forming a magnetic body layer on a second surface opposite to the first surface of the chip; separating the chip from the temporary carrying disc; adsorbing and fixing the chip on which the magnetic body layer is formed on a magnetic carrier plate; forming a plastic package layer on the first surface of the chip, separating the chip from the magnetic carrier, and removing the magnetic body layer; and forming a rewiring layer on the second surface of the chip, wherein the rewiring layer is electrically connected with the conductive connecting piece. By adopting the magnetic adsorption technology, high precisio