Array punching equipment and method

The invention discloses array punching equipment which comprises a laser, and a beam expander, a lambda/2 wave plate, a light splitting module, a first reflecting mirror, a first lens, a spatial filter, a second lens, a second reflecting mirror and a processing head which are sequentially arranged a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG LI, WANG YUTAO, ZHANG LEI, LUO GONGXU, WANG HAO, HUANG XILING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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