Array punching equipment and method

The invention discloses array punching equipment which comprises a laser, and a beam expander, a lambda/2 wave plate, a light splitting module, a first reflecting mirror, a first lens, a spatial filter, a second lens, a second reflecting mirror and a processing head which are sequentially arranged along an emitting light path of the laser. The light splitting module is used for splitting an incident light beam into a plurality of beams and punching a micropore array on a sample. The equipment further comprises a main controller, and the laser, the light splitting module and the machining head are electrically connected with the main controller. The sample is placed on the workbench, and the workbench is electrically connected with the main controller. 本发明公开了一种阵列打孔设备，该设备包括，激光器，以及沿着所述激光器发射光路依次设置的扩束镜、λ/2波片、分光模块、第一反射镜、第一透镜、空间滤波器、第二透镜、第二反射镜、加工头。所述分光模块将入射光束分为多束，用于在样品上进行微孔阵列的打孔。所述设备还包括主控制器，所述激光器、分光模块、加工头电连接所述主控制器。所述样品被置于工作台上，所述工作台电连接所述主控制器。