COOLING SYSTEM, COOLING STRUCTURE AND ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING OR OPERATING A COOLING SYSTEM, COOLING STRUCTURE AND ELECTRONIC DEVICE

An electronic device includes a heat source and a heat distribution structure coupled with the heat source for distributing heat generated by the heat source during operation of the electronic device. 一种电子设备包括热源和与热源耦合的热分布结构，热分布结构用于分布在电子设备的操作期间由热源生成的热量。...

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Hauptverfasser:	MISHRA, COLUMBIA, KATIRAVAN D, JUSTIN M. HUTULA, PINJARI, NEHAKAUSA, SHI KAIEN, FRICK GUSTAVO, PAAVOLA JUHA TAPANI, MOORE CHRISTOPHER M, RAJU PRAKASH KUMAR, WU JIAYAN, RAGLAND DANIEL, NIAN SHIWEI, YABAMANIA, GUKUL, SEN, ARNAB, BAVA, RITU, KU CHIN-WEI, XIYONG TIAN, PARANJPE VIVEK, LIU WANYU, LIU JUNTING, LYU TUANXIN, CARBONE MARK, RAJA, KANNAN, HAYASHI RYOJI, YANG HUA, SONG PEIYANG, KRUKLINSKI EVAN PETER, JIANG YINXIAN, CARDENAS RUANDER, SHAIKH, JAVED, SUN GEORGE PAUTZ, WU JINGANG, LIU BAOMIN, THAKUR HARI SHANKER, RUAN GUANQI, MAKINEN MIKKO ANTERO, PICHUMANI, PRASANNA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	An electronic device includes a heat source and a heat distribution structure coupled with the heat source for distributing heat generated by the heat source during operation of the electronic device. 一种电子设备包括热源和与热源耦合的热分布结构，热分布结构用于分布在电子设备的操作期间由热源生成的热量。