Etching method for resin molded body and etching processing system for resin molded body
The processing system (1) is provided with an etching tank (2) and a circulation pipe (7) which flows out from the bottom of the etching tank (2) and flows back to the etching tank (2) again. A liquid delivery pump (8), a heat exchanger (9), a sulfuric acid concentration meter (10) and an oxidant co...
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creator | ISERI HAJIME YAMAKAWA HARUYOSHI YAMAMOTO, YUKI |
description | The processing system (1) is provided with an etching tank (2) and a circulation pipe (7) which flows out from the bottom of the etching tank (2) and flows back to the etching tank (2) again. A liquid delivery pump (8), a heat exchanger (9), a sulfuric acid concentration meter (10) and an oxidant concentration meter (11) are arranged in the circulation piping (7). The sulfuric acid concentration meter (10) and the oxidant concentration meter (11) can transmit the measurement results to the calculation/control device (12). In addition, hydrogen peroxide water, sulfuric acid, and pure water can be supplemented to the etching bath (2) by using a hydrogen peroxide water supply line (13), a sulfuric acid supply line (14), and a pure water supply line (15), and the supply amounts of desired amounts of hydrogen peroxide water, sulfuric acid, and pure water can be adjusted by a calculation/control device (12). With such a treatment system, it is possible to etch a resin molded article by maintaining both the sulfuric |
format | Patent |
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A liquid delivery pump (8), a heat exchanger (9), a sulfuric acid concentration meter (10) and an oxidant concentration meter (11) are arranged in the circulation piping (7). The sulfuric acid concentration meter (10) and the oxidant concentration meter (11) can transmit the measurement results to the calculation/control device (12). In addition, hydrogen peroxide water, sulfuric acid, and pure water can be supplemented to the etching bath (2) by using a hydrogen peroxide water supply line (13), a sulfuric acid supply line (14), and a pure water supply line (15), and the supply amounts of desired amounts of hydrogen peroxide water, sulfuric acid, and pure water can be adjusted by a calculation/control device (12). With such a treatment system, it is possible to etch a resin molded article by maintaining both the sulfuric</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221101&DB=EPODOC&CC=CN&NR=115279943A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221101&DB=EPODOC&CC=CN&NR=115279943A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ISERI HAJIME</creatorcontrib><creatorcontrib>YAMAKAWA HARUYOSHI</creatorcontrib><creatorcontrib>YAMAMOTO, YUKI</creatorcontrib><title>Etching method for resin molded body and etching processing system for resin molded body</title><description>The processing system (1) is provided with an etching tank (2) and a circulation pipe (7) which flows out from the bottom of the etching tank (2) and flows back to the etching tank (2) again. A liquid delivery pump (8), a heat exchanger (9), a sulfuric acid concentration meter (10) and an oxidant concentration meter (11) are arranged in the circulation piping (7). The sulfuric acid concentration meter (10) and the oxidant concentration meter (11) can transmit the measurement results to the calculation/control device (12). In addition, hydrogen peroxide water, sulfuric acid, and pure water can be supplemented to the etching bath (2) by using a hydrogen peroxide water supply line (13), a sulfuric acid supply line (14), and a pure water supply line (15), and the supply amounts of desired amounts of hydrogen peroxide water, sulfuric acid, and pure water can be adjusted by a calculation/control device (12). With such a treatment system, it is possible to etch a resin molded article by maintaining both the sulfuric</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIhwLUnOyMxLV8hNLcnIT1FIyy9SKEotzsxTyM3PSUlNUUjKT6lUSMxLUUiFKiwoyk9OLS4GMYsri0tSc7Hr4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoamRuaWlibGjsbEqAEAjdo6QQ</recordid><startdate>20221101</startdate><enddate>20221101</enddate><creator>ISERI HAJIME</creator><creator>YAMAKAWA HARUYOSHI</creator><creator>YAMAMOTO, YUKI</creator><scope>EVB</scope></search><sort><creationdate>20221101</creationdate><title>Etching method for resin molded body and etching processing system for resin molded body</title><author>ISERI HAJIME ; YAMAKAWA HARUYOSHI ; YAMAMOTO, YUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115279943A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>ISERI HAJIME</creatorcontrib><creatorcontrib>YAMAKAWA HARUYOSHI</creatorcontrib><creatorcontrib>YAMAMOTO, YUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ISERI HAJIME</au><au>YAMAKAWA HARUYOSHI</au><au>YAMAMOTO, YUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Etching method for resin molded body and etching processing system for resin molded body</title><date>2022-11-01</date><risdate>2022</risdate><abstract>The processing system (1) is provided with an etching tank (2) and a circulation pipe (7) which flows out from the bottom of the etching tank (2) and flows back to the etching tank (2) again. A liquid delivery pump (8), a heat exchanger (9), a sulfuric acid concentration meter (10) and an oxidant concentration meter (11) are arranged in the circulation piping (7). The sulfuric acid concentration meter (10) and the oxidant concentration meter (11) can transmit the measurement results to the calculation/control device (12). In addition, hydrogen peroxide water, sulfuric acid, and pure water can be supplemented to the etching bath (2) by using a hydrogen peroxide water supply line (13), a sulfuric acid supply line (14), and a pure water supply line (15), and the supply amounts of desired amounts of hydrogen peroxide water, sulfuric acid, and pure water can be adjusted by a calculation/control device (12). With such a treatment system, it is possible to etch a resin molded article by maintaining both the sulfuric</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | Etching method for resin molded body and etching processing system for resin molded body |
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