Small-spacing wave crest material and welding method thereof

The invention discloses a small-spacing wave crest material and a welding method thereof, and the small-spacing wave crest material comprises a circuit board; the mounting material is mounted on the surface of one side of the circuit board; the wave crest material comprises a plurality of plug-ins,...

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1. Verfasser: YU GONGCHI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a small-spacing wave crest material and a welding method thereof, and the small-spacing wave crest material comprises a circuit board; the mounting material is mounted on the surface of one side of the circuit board; the wave crest material comprises a plurality of plug-ins, and the plug-ins are welded to the surface of the side, where the mounting material is mounted, of the circuit board; wherein the distance between the mounting material and the wave crest material is not more than 1mm. Through the structure, material welding short circuit can be prevented, and the surface welding area of the circuit board is saved. 本申请公开了一种小间距波峰物料及其焊接方法,其中,小间距波峰物料包括:电路板;贴装物料,所述贴装物料贴装于所述电路板的一侧表面;波峰物料,所述波峰物料包括多个插件,所述插件焊接于所述电路板贴装有所述贴装物料的一侧表面;其中,所述贴装物料与所述波峰物料的距离不超过1毫米。通过上述结构,可以防止物料焊接短路,节省电路板表面焊接面积。