Use of magnetic field to increase bonding area of adhesive joint

The invention relates to using a magnetic field to increase the bonding area of an adhesive joint. The present application relates to assembly techniques for joining components using magnetic adhesives. A liquid adhesive comprising magnetic particles is provided, the liquid adhesive having sufficient properties that allow the adhesive to flow under the influence of a magnetic field prior to curing. The method for connecting components includes the steps of: applying an adhesive to a substrate at a location corresponding to a joint; placing a magnetic element proximate the joint to generate a magnetic field that interacts with the magnetic particles in the adhesive to flow the adhesive in a direction corresponding to the magnetic field; and curing the magnetic adhesive under the influence of the magnetic field. An assembly jig for connecting components includes a magnetic element and optionally an induction heating element. The assembly technique may be used to form a housing for an electronic device from two