Rapid and high-precision silicon steel plate unevenness detection method

The invention relates to a silicon steel plate unevenness detection technology, in particular to a rapid and high-precision silicon steel plate unevenness detection method. The problem that an existing silicon steel plate unevenness detection method cannot give consideration to detection precision a...

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Hauptverfasser: CHEN PING, DONG BOHANG, WU YANGXU, ZHAO XIAOJIE, WANG HUIYU, SHEN SIYUAN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to a silicon steel plate unevenness detection technology, in particular to a rapid and high-precision silicon steel plate unevenness detection method. The problem that an existing silicon steel plate unevenness detection method cannot give consideration to detection precision and detection speed at the same time is solved. The invention relates to a rapid high-precision silicon steel plate unevenness detection method, which is realized by adopting the following steps of: 1, irradiating the edge of a silicon steel plate by utilizing a uniform line light source, and acquiring an edge wave image of the edge of the silicon steel plate by utilizing an industrial camera; 2, segmenting an ROI (Region of Interest) region of the edge wave image by using a seed point growth method taking a brightness gradient as a growth criterion; step 3, carrying out image enhancement on the ROI region by using three-scale Gaussian filtering; step 4, performing binarization processing on the ROI region by using