Preparation method of wafer surface granularity standard sample wafer and standard sample wafer

The invention provides a preparation method of a wafer surface granularity standard sample wafer and the standard sample wafer. The method comprises the following steps: making a granularity standard template structure diagram based on a wafer with a determined size; the granularity standard templat...

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Bibliographische Detailangaben
Hauptverfasser: LI SUOYIN, ZHANG JIAHUAN, ZHANG XIAODONG, WU AIHUA, ZOU XUEFENG, HAN ZHIGUO, ZHAO LIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a preparation method of a wafer surface granularity standard sample wafer and the standard sample wafer. The method comprises the following steps: making a granularity standard template structure diagram based on a wafer with a determined size; the granularity standard template structure diagram comprises a plurality of cylindrical arrays with different sizes; manufacturing a target mask plate according to the granularity standard template structure diagram, and transferring a pattern on the target mask plate to the wafer by utilizing a photoetching process to obtain a target wafer; and etching the target wafer by adopting an etching process to obtain a wafer surface granularity standard sample wafer. According to the invention, the service life of the wafer surface granularity standard sample wafer can be prolonged. 本发明提供一种晶圆表面颗粒度标准样片的制备方法及标准样片。该方法包括基于已确定尺寸的晶圆片,制作颗粒度标准样板结构图;所述颗粒度标准样板结构图中包括多个不同尺寸的圆柱阵列;按照所述颗粒度标准样板结构图制作目标掩模板,并利用光刻工艺,将所述目标掩模板上的图形转移到所述晶圆片上,得到目标晶圆片;采用刻蚀工艺对所述目标晶圆片进行刻蚀,得到晶圆表面颗