Wafer processing thinning machine

The invention relates to a wafer processing thinning machine, and belongs to the technical field of wafer processing equipment. Comprising a mounting box, the mounting box is of a columnar structure, an opening is formed in the bottom of the mounting box and rotationally connected with a rotating plate, and an adjusting mechanism used for adjusting rotation of the rotating plate is arranged on the outer wall of one side of the mounting box; the top of the rotating plate is rotationally connected with a rotating column, and the outer wall of the top of the mounting box is fixedly connected with a driving motor. The three procedures of accurate grinding, rough grinding and polishing are integrated together, all machining can be completed without transferring the wafer back and forth in the whole machining process, the safety of the wafer is guaranteed, the equipment size is smaller, operation is simpler, and the machining efficiency is improved. And meanwhile, the three working procedures of accurate grinding,