High-entropy alloy soft solder containing Sn and Cu and preparation method of high-entropy alloy soft solder

The invention discloses a high-entropy alloy soft solder containing Sn and Cu, the soft solder is composed of five components, namely Sn, Cu and any three of Co, Ni, Bi, Zn and Sb, the soft solder is a high-temperature soft solder and a medium-temperature soft solder, the other four components, exce...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FAN JIANGLEI, WANG NINGGE, WU SHEN, ZHOU XIANGKUI, WANG JIAOJIAO, LI YING, LIU JIANXIU, WEI ZEXIN, WANG YAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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