High-entropy alloy soft solder containing Sn and Cu and preparation method of high-entropy alloy soft solder

The invention discloses a high-entropy alloy soft solder containing Sn and Cu, the soft solder is composed of five components, namely Sn, Cu and any three of Co, Ni, Bi, Zn and Sb, the soft solder is a high-temperature soft solder and a medium-temperature soft solder, the other four components, except Sn, of the high-temperature soft solder have the same atomic percent of 18-24%, and the balance is Sn; the medium-temperature soft solder comprises the following four components except Sn: 5-12% of the same atom percentage content, and the balance of Sn. The five-element tin-based lead-free high-temperature soft solder and the five-element tin-based lead-free medium-temperature soft solder are developed according to the basic design principle of the high-entropy alloy, namely, the mechanical property and the brazing property of the high-entropy alloy soft solder are improved through multiple effects of the high-entropy alloy, and the brazing stability and reliability are improved. 本发明公开一种含有Sn、Cu的高熵合金软钎料，所述软钎料由五种