Micropore machining method based on ultrafast laser

The invention discloses a micropore machining method based on ultrafast laser. The micropore machining method comprises the steps that a workpiece is fixed to a machining position; position parameters and machining parameters of the to-be-machined micropores are set; laser is controlled to machine the workpiece according to the first machining path, so that a circular micropore is formed in the workpiece; and the laser is controlled to machine the circular micro-hole according to the second machining path, and the circular micro-hole is corrected into the square micro-hole. According to the invention, the workpiece can be processed through ultrafast laser, so that a round micropore is firstly formed on the workpiece, and then a required square micropore is formed on the workpiece. In the whole machining process, the machining precision is high, and meanwhile the machining efficiency is high. 本发明公开了一种基于超快激光的微孔加工方法，包括步骤：将工件固定到加工位置；设置待加工微孔的位置参数及加工参数；控制激光以第一加工路径，对工件进行加工，使工件上形成圆形微孔；控制激光以第二加工路径，对圆形微孔进行加工，使圆形微孔修正为方形