Laser processing equipment and laser beam splitting light path control system
The invention discloses a laser beam splitting light path control system, which comprises a beam expander, a lambda/2 wave plate and a spectroscope which are sequentially arranged along a laser light path emitted by a laser, and a first attenuator and a first processing head which are sequentially a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a laser beam splitting light path control system, which comprises a beam expander, a lambda/2 wave plate and a spectroscope which are sequentially arranged along a laser light path emitted by a laser, and a first attenuator and a first processing head which are sequentially arranged along a reflecting light path of the spectroscope, and the reflecting mirror, the second attenuator and the second processing head are sequentially arranged along a transmission light path of the spectroscope. A first target material is arranged on the first working table, and the first target material on the first working table is machined through the first machining head. A second target material is arranged on the second workbench, and the second target material on the second workbench is machined through the second machining head.
本发明公开了一种激光器分束光路控制系统,该控制系统包括,沿着激光器发射的激光光路依次设置的扩束镜、λ/2波片、分光镜,以及沿着所述分光镜反射光路依次设置的第一衰减器、第一加工头,沿着所述分光镜透射光路依次设置的反射镜、第二衰减器、第二加工头。在第一工作台上设置有第一靶材,由第一加工头对在第一工作台上的第一靶材进行加工。在第二工作台上设置有第二靶材, |
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