High-density DFN advanced packaging structure

The invention discloses a high-density DFN advanced packaging structure, relates to the field of DFN packaging, and solves the problems that when an existing high-density DFN packaging structure is used, an internal chip and an epoxy insulating shell are integrally formed and are difficult to disassemble, assemble and replace, and the use is not convenient enough, the high-density DFN advanced packaging structure comprises a base, a chip, a top cover, a fixing device, a bonding pad mechanism and a disassembly and assembly mechanism, according to the high-density DFN advanced packaging structure, the overall packaging is conveniently converted into a plurality of parts, and meanwhile, the stable connection among the parts is ensured, so that the packaging structure can be quickly disassembled and assembled after any part breaks down; meanwhile, the whole base can be rapidly taken down from the PCB for replacement independently under the condition that an original conductive bonding pad welded to the PCB is not