Semiconductor device

The semiconductor device includes a conductive member, a semiconductor element, and a bonding layer. The conductive member has a main surface and a back surface facing opposite to each other in the thickness direction. The semiconductor element has a main body layer and a plurality of electrodes pro...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUJII KENJI, NII, AKINORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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