Semiconductor device

The semiconductor device includes a conductive member, a semiconductor element, and a bonding layer. The conductive member has a main surface and a back surface facing opposite to each other in the thickness direction. The semiconductor element has a main body layer and a plurality of electrodes protruding toward the main surface from a side facing the main surface in the thickness direction of the main body layer. The bonding layer bonds the main surface and the plurality of electrodes together. Each of the plurality of electrodes has: a base portion in contact with the body layer; and a columnar portion protruding from the base portion and in contact with the bonding layer. The plurality of electrodes includes: a first electrode; and a second electrode positioned closer to the peripheral edge of the main body layer than the first electrode when viewed in the thickness direction. The area of the columnar portion of the second electrode is larger than the area of the columnar portion of the first electrode wh