Chip mass transfer packaging deviation rectification and alignment system and application method thereof

The invention discloses a chip mass transfer packaging deviation rectifying and aligning system and an application method thereof. The chip mass transfer packaging deviation rectifying and aligning system comprises a loading moving plate, a chip loading platform and a horizontal deviation detecting assembly. The chip loading platform comprises a loading disc assembly, an inclination leveling assembly, a horizontal offset adjusting assembly, an inclination detector and a controller. The chip is loaded on the loading disc assembly; the inclination detector is used for measuring parallelism deviation; the inclined leveling assembly is used for correcting parallelism deviation; the horizontal deflection detection assembly is used for measuring horizontal rotation angle deviation. The alignment deviation between the loading disc assembly and the display panel is accurately detected through the inclination detector and the horizontal deviation detection assembly, and then deviation correction of the parallelism dev