Packaging structure and preparation method of QD-mini LED

The invention belongs to the technical field of packaging, and discloses a QD-mini LED packaging structure, which comprises pixel pits, LED light-emitting chips and quantum dots, the LED light-emitting chips are inversely arranged in the pixel pits, the quantum dots are filled in the pixel pits, eve...

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Bibliographische Detailangaben
Hauptverfasser: YANG XIAOTIAN, HUANG PEIXUAN, PAN YAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention belongs to the technical field of packaging, and discloses a QD-mini LED packaging structure, which comprises pixel pits, LED light-emitting chips and quantum dots, the LED light-emitting chips are inversely arranged in the pixel pits, the quantum dots are filled in the pixel pits, every two adjacent pixel pits are separated by a retaining wall, and the LED light-emitting chips and the quantum dots are arranged in the retaining wall. A first TFE layer, a PHPS layer and a second TFE layer are arranged on the pixel pits and the quantum dots in a layered mode from bottom to top. The structure of the quantum dot packaging structure comprises the LED light-emitting chip, the QD solution, the TFE layer, the PHPS layer and the TFE layer from bottom to top, so that compared with an existing packaging technology, the process is simplified, a rapid ink-jet printing technology is used for replacing an ALD technology which is long in time consumption, the time cost is greatly reduced, and meanwhile it can b