Preparation method of double-phase gallium-indium alloy for flexible electronic printing
The invention discloses a preparation method of a dual-phase gallium-indium alloy for flexible electronic printing. The preparation method comprises the following steps: mixing a gallium-indium alloy with ethanol, and performing ultrasonic treatment to form uniform alloy ink; spraying the alloy ink...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a preparation method of a dual-phase gallium-indium alloy for flexible electronic printing. The preparation method comprises the following steps: mixing a gallium-indium alloy with ethanol, and performing ultrasonic treatment to form uniform alloy ink; spraying the alloy ink on the silicon wafer by a spray gun, quickly drying, and repeatedly spraying to obtain a solid-liquid phase multi-layer film; scraping off the multiple layers of thin films from the silicon wafer to obtain a solid phase-liquid phase coexisting double-phase gallium indium alloy coating bGaIn; a CO2 laser is used for engraving and manufacturing a mask, and bGaIn can be printed on various substrates through the mask to form flexible circuits and patterns; the bGaIn circuit can be recycled through a simple method to manufacture a new flexible circuit. The gallium-indium alloy modification method has the advantages of being simple in process, low in cost, customizable, high in efficiency and environmentally friendly, la |
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