Photosensitive compound, photosensitive composition, and patterning method

The present disclosure relates to a photosensitive compound, a photosensitive composition including the photosensitive compound, and a patterning method using the photosensitive composition. The patterning method includes providing a photosensitive composition on a material layer. The photosensitive composition includes: 1 part by weight of a photosensitive compound; 1.5 to 8 parts by weight of a resin; and 10 to 40 parts by weight of a diluent. The structure of the photosensitive compound is as follows: the patterning method further comprises the step of removing a diluent in the photosensitive composition to form a photoresist layer; exposing the photoresist layer; and removing the exposed portion of the photoresist layer with a developer to expose a portion of the material layer. The photosensitive compound disclosed by the invention is suitable for digital exposure, can enable the adjustment of a photoresist formula to be more flexible, and has high resolution. 本揭露涉及一种感光化合物、包含该感光化合物的感光组合物、以及一种利用该感光组合物的图案化