High-temperature drawing device for pure copper wire
The invention relates to the technical field of pure copper wire drawing, and provides a pure copper wire high-temperature drawing device, which is characterized in that a copper wire is subjected to heat treatment, so that the change of a microstructure in the copper wire is reduced, the dislocatio...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of pure copper wire drawing, and provides a pure copper wire high-temperature drawing device, which is characterized in that a copper wire is subjected to heat treatment, so that the change of a microstructure in the copper wire is reduced, the dislocation movement is hindered by the increase of grain refinement grain boundaries, and an obvious work hardening phenomenon is generated; the copper wire drawing machine comprises a drawing machine body and a base, the bottom end of the drawing machine body is connected with the top end of the base, the top end of the base is fixedly connected with a bottom plate through a plurality of supporting columns, the top end of the bottom plate is fixedly connected with a top plate through two supporting plates, and the opposite ends of the two supporting plates are rotationally connected with gears; two connecting plates are arranged between the top plate and the bottom plate, sliding barrels are fixedly connected to the opposi |
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