PH-buffered slurry and application for polishing thereof

一种含有磨料颗粒和pH值缓冲组分的浆液特别适用于抛光表面，包括在微电子学中的应用，该浆液含有至少一种酸或其盐以及至少一种碱。 A slurry containing abrasive particles and a pH buffering component comprising at least one acid or salt thereof and at least one base is especially useful for polishing surfaces, including those used in microelectronics....

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Bibliographische Detailangaben
Hauptverfasser:	MAHADEVAIYER KIRSHNAN, CUC KIM HUYNH, MICHAEL JOSEPH MACDONALD
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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Beschreibung
Zusammenfassung:	一种含有磨料颗粒和pH值缓冲组分的浆液特别适用于抛光表面，包括在微电子学中的应用，该浆液含有至少一种酸或其盐以及至少一种碱。 A slurry containing abrasive particles and a pH buffering component comprising at least one acid or salt thereof and at least one base is especially useful for polishing surfaces, including those used in microelectronics.