Method for producing power module unit

The invention relates to a method for producing a power module unit (4). In order to improve the heat dissipation of the power module unit (4), it is proposed that the cooling fins (6) are positioned in recesses (10) of a frame (8), in particular of metal, a first metal material (14) is applied to t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SCHMENGER JENS, KAPPAUF, DANIEL, PANICELSKI, STANISLAV
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention relates to a method for producing a power module unit (4). In order to improve the heat dissipation of the power module unit (4), it is proposed that the cooling fins (6) are positioned in recesses (10) of a frame (8), in particular of metal, a first metal material (14) is applied to the cooling fins (6) and the frame (8) by means of a thermal spraying method, and a cohesive connection is established between the cooling fins (6) and the frame (8) by means of the applied first metal material (14). 本发明涉及一种用于制造功率模块单元(4)的方法。为了改进功率模块单元(4)的散热而提出：将冷却片(6)定位在特别是金属的框架(8)的凹陷部(10)中，其中，借助于热喷涂法将第一金属材料(14)施加到冷却片(6)和框架(8)上，其中，通过所施加的第一金属材料(14)在冷却片(6)与框架(8)之间建立材料配合的连接。