Production process of high-density interconnection HDI (High Density Interconnection) board
The invention discloses a high density interconnection HDI board production technology, and relates to the HDI board production technology field, the HDI board production technology comprises a PCB, silicone rubber, two release molds, two kraft paper and separation steel plates, the two release mold...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a high density interconnection HDI board production technology, and relates to the HDI board production technology field, the HDI board production technology comprises a PCB, silicone rubber, two release molds, two kraft paper and separation steel plates, the two release molds are respectively arranged on the upper side and the lower side of the PCB, the two separation steel plates are respectively arranged on the two opposite sides of the release molds, and the two kraft paper is arranged on the two separation steel plates. The two pieces of kraft paper are arranged on the two opposite sides of the two separating steel plates respectively, and the silicon rubber is arranged between the upper side release mold and the separating steel plates. The PCB comprises a layer A, a layer B, a layer C and a layer D, the layer A is of a one-layer and two-layer structure made of Ro4350B ceramic materials, the layer B is of a three-layer and four-layer structure made of 370HR FR4 plate materials, a |
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