High-efficiency anti-interference integrated circuit system

The invention discloses a high-efficiency anti-interference integrated circuit system, and relates to a circuit system, the high-efficiency anti-interference integrated circuit system comprises a mounting plate, packaging chip modules are mounted on the mounting plate, adjacent packaging chip module...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YAN JUNYAN, YAN JUNLING, CHEN ZHIJIE, YANG DANCHUN, YANG SHAOYI, YANG SHAONA, YAN JUNQI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a high-efficiency anti-interference integrated circuit system, and relates to a circuit system, the high-efficiency anti-interference integrated circuit system comprises a mounting plate, packaging chip modules are mounted on the mounting plate, adjacent packaging chip modules are isolated through etching lines, and each packaging chip module comprises a metal layer, an IC chip, a filling layer, a base layer and a crimping part; the crimping part comprises a bottom plate, a chip groove, a pressing plate part, a fixing part, a side edge supporting seat and connecting pins, the chip groove is formed in the bottom plate, the connecting pins are uniformly arranged on the bottom plate, the connecting pins are led out from the bottom plate, the side edge supporting seat is fixed on the side edge of the bottom plate, the pressing plate part is arranged on the side edge supporting seat, and the chip groove is formed in the chip groove. The pressing plate piece is fixed through a fixing piece.