Electronic equipment and assembling method thereof
The invention provides electronic equipment and an assembling method thereof. The electronic equipment comprises a middle frame, a bonding piece and a bent cover plate. The middle frame comprises a first assembly surface and a first outer surface which are connected, and a step groove is formed betw...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides electronic equipment and an assembling method thereof. The electronic equipment comprises a middle frame, a bonding piece and a bent cover plate. The middle frame comprises a first assembly surface and a first outer surface which are connected, and a step groove is formed between the first assembly surface and the first outer surface; the bonding piece is arranged in the step groove; the bent cover plate comprises a body and a bent part in bent connection with the periphery of the body, and a second assembling face is formed at the end, away from the body, of the bent part. Wherein the first assembling surface and the second assembling surface are oppositely arranged, and bonding connection of the first assembling surface and the second assembling surface is achieved through a bonding piece; and the second outer surface of the bent cover plate, the third outer surface of the bonding piece and the first outer surface form a smooth surface. According to the electronic equipment, the arran |
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