Laser perforation processing method and numerical control system
The invention relates to a laser perforation processing method and a numerical control system, the method is suitable for processing a plate with the thickness of more than 60mm, and the method comprises the following steps: inputting basic parameters for laser perforation on an operation interface...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a laser perforation processing method and a numerical control system, the method is suitable for processing a plate with the thickness of more than 60mm, and the method comprises the following steps: inputting basic parameters for laser perforation on an operation interface of the numerical control system; after the numerical control system is initialized, the cutting head is controlled to move to a reference position according to the basic parameters; the numerical control system sequentially carries out perforating operation on the to-be-machined plate according to the control parameters of the first stage, the second stage and the third stage, so that the to-be-machined plate is stably perforated; the basic parameters comprise control parameters, initial values, dynamic change equations, termination conditions and the like of the first stage, the second stage and the third stage; the first stage is a static puncture stage, and the second stage and the third stage are both dynamic p |
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