Method for improving poor processing of solder resist plug hole

The invention belongs to the technical field of PCBs (printed circuit boards), and provides a method for improving poor processing of solder resist plug holes, which comprises the following steps: pretreatment, solder resist plug holes, solder resist ink, solder resist pre-baking, solder resist pattern transfer, solder resist developing, character printing and post-curing. In the post-curing process, segmented board baking processing is adopted and comprises a first segment of board baking and a second segment of board baking, the first segment of board baking is baked for 60-100 min at the temperature of 60-80 DEG C, and the second segment of board baking is baked for 60-100 min at the temperature of 120-180 DEG C. According to the method disclosed by the invention, the parameter method in the solder resist curing baking process is improved in a targeted manner, the product yield is greatly improved, the bad abnormity such as cavitation or bubbling is not found in FQC finished product inspection, the reject