Impedance measurement chip for heterogeneous internet of things

The invention discloses a heterogeneous interconnection Internet of Things impedance measurement chip, and relates to the field of impedance measurement chips, the heterogeneous interconnection Internet of Things impedance measurement chip comprises a function module and a heterogeneous interconnect...

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Bibliographische Detailangaben
Hauptverfasser: HU BINGXIANG, WANG ZIXIN, HUANG JUNLONG, LIANG YAN, CHEN RUNMING, MOU BINGRUI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a heterogeneous interconnection Internet of Things impedance measurement chip, and relates to the field of impedance measurement chips, the heterogeneous interconnection Internet of Things impedance measurement chip comprises a function module and a heterogeneous interconnection structure, the function module comprises an Internet of Things chip module, a communication interface, a sensor module, a power management module, a microprocessor module, a memory module, a digital signal processing module and a signal conditioning link module; the functional modules are integrated on the heterogeneous interconnection structure, and circuit interconnection is established between the functional modules; the microprocessor module is electrically connected with the memory module, the digital signal processing module, the communication interface, the sensor module, the signal conditioning link module and the Internet of Things chip; the digital signal processing module is electrically connected wi