Polymeric film containing silicone resin and clay

A polymeric film comprising a first layer of polymeric material having on at least one surface thereof a second layer of polymeric material comprising, based upon the weight of the polymer in the second layer, (a) 0.05% to 2.0% by weight of silicone resin particles and/or calcined silicone resin par...

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Bibliographische Detailangaben
Hauptverfasser:	P. D. A. MILLS, J. A. SIDDIQUI, A. R. KARL
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	A polymeric film comprising a first layer of polymeric material having on at least one surface thereof a second layer of polymeric material comprising, based upon the weight of the polymer in the second layer, (a) 0.05% to 2.0% by weight of silicone resin particles and/or calcined silicone resin particles having a volume distributed median particle diameter of 1.5 to 12.5 mu m, and (b) 0.005% to 1.0% by weight of china clay particles having a volume distributed median particle diameter of 0.1 to 2.0 mu m.